DATE:   08-OCT-2008

REF: Si5338-EVB REV 1.0

TECHNOLOGY:
	6-LAYERS, IMPEDANCE CONTROLLED
	MINIMUM TRACE/SPACE: 0/6
	MINIMUM SMD PITCH: 0.4MM
	SMD PAD COUNT:
		PRI: 69
		SEC: 738

TEST REQUIREMENTS: IPC-D-356 NETLIST

CONTACT:
	Chuck Tidwell
	VOICE:(512)428-1683
	CELL:(512)797-8024
	FAX:(512)428-1090
	chuck.tidwell@silabs.com

SHIPPING DESTINATION: (UNLESS OTHERWISE NOTED)
	FedEx Priority Overnight
	Act# 217859387

Attn: Wireline Eng. Svc.
	Silicon Laboratories
	400 W. Cesar Chavez St.
	Suite 4075
	Austin, TX  78701

GERBER FILE FORMAT:
	RS-274-X
	2.5
	ENGLISH
	ABSOLUTE
	TRAILING ZEROS SUPPRESSED

FILES PROVIDED:
      DESCRIPTION	       	PLOT FILE
      -----------	       	----------
	PRIMARY SILKSCREEN	533xCEVB_PSS.PHO
	PRIMARY SOLDERMASK	533xCEVB_PSM.PHO
	PRIMARY SIDE	   	533xCEVB_PRI.PHO
	GROUND PLANE   		533xCEVB_L02.PHO
	SIGNAL/GND		   	533xCEVB_L03.PHO
	GROUND PLANE   		533xCEVB_L04.PHO
	POWER PLANE	   		533xCEVB_L05.PHO
	SECONDARY SIDE		533xCEVB_SEC.PHO
	SECONDARY SOLDER MASK	533xCEVB_SSM.PHO
	SECONDARY SILKSCREEN	533xCEVB_SSS.PHO
	FABRICATION DRAWING	533xCEVB_FAB.PHO
	APERTURE FILE		533xCEVB_APR.REP
	NC DRILL DATA		533xCEVB_NC.DRL
	NC DRILL TOOLS		533xCEVB_NC.REP
	IPC-D-356 NETLIST		533xCEVB_NET.IPC

ADDITIONAL FILES:
	PRIMARY ASSEMBLY		533xCEVB_PASM.PHO
	SECONDARY ASSEMBLY	533xCEVB_SASM.PHO
	PRIMARY PASTE MASK	533xCEVB_PSP.PHO
	SECONDARY PASTE MASK	533xCEVB_SSP.PHO
