Please note: this product is being discontinued and is not recommended for new designs.
The AWB7224 is a fully matched, Multi-Chip-Module
(MCM) designed for picocell, femtocell, and customer
premises equipment (CPE) applications. Consisting of
two parallel path high linearity, high efficiency power
amplifiers, the device meets the extremely demanding
needs of small cell infrastructure architectures.
Designed for LTE, WCDMA and HSDPA air interfaces
operating in the 728 MHz to 768 MHz bands, the
AWB7224 delivers up to +27 dBm of LTE (E-TM1.1)
power through an external 90-degree hybrid coupler,
with an ACPR of -47 dBc. The device operates from
a convenient +4.5 V supply and provides 29 dB of
RF gain. The AWB7224 is manufactured using an
advanced InGaP HBT MMIC technology offering
state-of-the-art reliability, temperature stability, and
ruggedness. Its 7 mm x 7 mm x 1.3 mm surface
mount package incorporates RF matching networks
optimized for output power, efficiency, and linearity in
a 50 V system.