Please note: this product is being discontinued and is not recommended for new designs.
The AWB7225 is a fully matched, Multi-Chip-Module
(MCM) designed for picocell, femtocell, and customer
premises equipment (CPE) applications. Consisting of
two parallel path high linearity, high efficiency power
amplifiers, the device meets the extremely demanding
needs of small cell infrastructure architectures.
Designed for LTE, WCDMA and HSDPA air interfaces
operating in the 860 MHz to 894 MHz bands, the
AWB7225 delivers up to +27 dBm of LTE (E-TM1.1)
power through an external 90-degree hybrid coupler,
with an ACPR of -48 dBc. The device operates from
a convenient +4.5 V supply and provides 30 dB of
RF gain. The AWB7225 is manufactured using an
advanced InGaP HBT MMIC technology offering
state-of-the-art reliability, temperature stability, and
ruggedness. Its 7 mm x 7 mm x 1.3 mm surface
mount package incorporates RF matching networks
optimized for output power, efficiency, and linearity in
a 50 V system.