The SKY66523-11 is part of high-efficiency, pin compatible PAfamily supporting major 3GPP bands.
]]>SMV1251 Series includes SMV1251-079LF and SMV1251-040LF.
The SMV1247-SMV1255 group of silicon hyperabrupt junction varactor diodes is designed for use in Voltage Controlled Oscillators (VCOs) with a low tuning voltage operation. This group of varactors is characterized for capacitance and resistance over temperature.
]]>The SKY77365 power amplifier module (PAM) is designed for 2G quad-band cellular handsets supporting fixed gain Gaussian Minimum-Shift Keying (GMSK) and fixed gain linear Enhanced Data for GSM Evolution (EDGE) modulation in the GSM850/900, DCS1800 and PCS1900 bands. Class12 General Packet Radio Service (GPRS) multi-slot operation is also supported.
The compact 3.0 mm x 3.5 mm x 0.8 mm module consists of GSM850/900 and DCS1800/PCS1900 power amplifier blocks, 50-ohm input and output matching circuitry, and a multi-function power amplifier control (MFC) block. The custom silicon CMOS MFC provides PA bias and product identification read-back capability and is fully programmable through the RF Front-End Mobile Industry Processor Interface (RFFE MIPI®).
The heterojunction bipolar transistor (HBT) power amplifier blocks are fabricated onto a single lnGaP die; one supports the GSM850/900 bands and the other supports the DCS1800/PCS1900 bands. Both PA blocks share two common power supply pads. The InGaP die, silicon die, and the passive components are mounted on a multi-layer laminate substrate. The entire assembly is encapsulated with plastic overmold.
The SKY67302-11 consists of a low-noise amplifier, digital stepattenuator and I2C circuit to digitally control the module. Thismodule architecture provides excellent return loss, low noise, andhigh-linearity performance.
The internal active bias circuitry ensures repeatable performanceover temperature. The device is fully integrated and requiresminimal external components.
The SKY67302-11 is manufactured in an 8 x 8 mm,16-pin Multi-Chip Module (MCM) package. The SKY67302-11 ispart of a family of LNAs that cover the frequency range of648 MHz to 2020 MHz.
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]]>The SKY66423-11 is a high performance, highly integrated RF front-end module designed for LPWAN – supporting LoRa®, SigFox and other unlicensed band technologies – as well as high-power Industrial, Scientific, Medical (ISM) applications operating in the 860-930 MHz frequency range.
The SKY66423-11 is designed for ease of use and maximum flexibility with fully matched 50 Ω TX and RX inputs and antenna outputs, and digital controls compatible with 1.6 to 3.6 V CMOS levels.
The RF blocks operate over a wide supply voltage range from 2.0 to 4.8 V allowing the SKY66423-11 to be used in battery powered applications over a wide spectrum of the battery discharge curve.
The SKY66423-11 is packaged in a 16-pin, 3.0 x 3.0 x 0.75 mm Multi-Chip Module (MCM) package.
Reference Design(s): Semtech: SX1261
The SKY66415-11 is a high-performance, fullyintegrated RF front-end module (FEM) designed forBluetooth® (including low energy), Zigbee®, andThread applications.
The SKY66415-11 is designed for ease of use andmaximum flexibility. The device provides a poweramplifier, low-noise amplifier, low-loss bypass path,and transmit/receive switches. The RF blocks operateover a wide supply voltage range from 1.7 V to 2.0 Vthat allows the SKY66415-11 to be used in batterypoweredapplications over a wide spectrum of thebattery discharge curve.
The SKY66411-11 is a high-performance, fullyintegrated RF front-end module (FEM) designed forBluetooth® (including low energy), Zigbee®, andThread applications.
The SKY66411-11 is designed for ease of use andmaximum flexibility. The device provides a poweramplifier, low-noise amplifier, low-loss bypass path,and transmit/receive switches.
The PA and LNA operate over wide supply voltageranges, allowing the SKY66411-11 to be used inbattery-powered applications over a wide spectrum ofthe battery discharge curve.
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About the EM250 & EM260 
The Ember EM250 system-on-chip (SoC) along with the EmberZNet PRO networking stack is the industry's only true SoC platform supporting the ZigBee PRO Feature Set. The EM250 integrates an IEEE 802.15.4 radio, a 16-bit microprocessor, flash, random access memory (RAM) and peripherals delivering excellent performance at a low system cost.
The Ember EM260 is the industry's first ZigBee network co-processor that combines a 2.4 gigahertz (GHz) IEEE 802.15.4 compliant radio transceiver with a flash-based microprocessor running the EmberZNet PRO ZigBee stack. The EM260 delivers unparalleled flexibility allowing developers to easily add ZigBee networking to their preferred application microprocessor via a fast SPI/UART interface.
The EM250 and EM260 chips are tightly integrated with EmberZNet PRO - The Ember "ZigBee Golden Unit" platform - and are optimized for designs requiring long battery life, low external component count, and a reliable, proven, industry-standard networking solution. Innovative on-chip debugging combined with Ember InSight tools provide developers with the most advanced views into their application and network available in the industry.
For more information regarding the EM250 and EM260 please visit: www.silabs.com.
The part is designed to sustain a peak voltage of 80 V typicalwithout going to breakdown.
The switching is controlled by an integrated Mobile IndustryProcessor Interface (MIPI®), v2.0 decoder.
The SKY59269-702LF is provided in a compact 12-pin,1.6 x 1.6 x 0.45 mm (typical) QFN package that meetsrequirements for board-level assembly.
]]>The diversity module supports all key 2, 3, and 4 carrier aggregation band combinations.
High-performance, multi-gain mode LNAs are integrated enabling compatibility to next generation LNA-less LTE transceivers.
The SKY53735-11 is compatible with 3GPP GSM, WCDMA, LTE, LTE-A, and 5G standards and includes filters for the following service bands: B12/13/17, B28A, B28B, B20, B8, B26/5/18/19, B32, B3, B39, B25(2), B34, B66(4), B1, B40, B41(38), and B7.
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About the EM35x System-on-Chip (SoC) / Network Co-Processor (NCP)
The EM351 and EM357 Ember® ZigBee chips are the industry’s leading ARM Cortex-M3 based family of ZigBee SoCs delivering unmatched performance, power consumption and code density in a compact package. The EM351 and EM357 combine a 2.4 GHz IEEE 802.15.4 radio transceiver with a 32-bit microprocessor, Flash memory and RAM with powerful hardware supported network-level debugging features. Combined with the powerful ecosystem of ARM tools, these devices and tools enable OEMs to simplify development and accelerate time to market.
The EM351 and EM357 SoCs are tightly integrated with EmberZNet PRO, a ZigBee compliant mesh networking software which is the most deployed ZigBee platform in the market.
EM35x chips can be designed in as full system-on-chip (SoC) devices for low cost, low power sensors and other devices in the home, or as network co-processor (NCP) devices for more complex applications running on a large applications microprocessor.250 and EM260 chips are tightly integrated with EmberZNet PRO - The Ember "ZigBee Golden Unit" platform - and are optimized for designs requiring long battery life, low external component count, and a reliable, proven, industry-standard networking solution. Innovative on-chip debugging combined with Ember InSight tools provide developers with the most advanced views into their application and network available in the industry.
For more information regarding the EM35x please visit: www.silabs.com.
The SE2436L is a high performance, fully integrated RF Front End Module designed for ZigBee/Smart Energy and 802.15.4 applications requiring high transmit power.
The SE2436L is designed for ease of use and maximum flexibility, with fully matched 50 Ω input and output, integrated inter-stage matching and harmonic filter, and digital controls compatible with 1.6 – 3.6 V CMOS levels.
The RF blocks operate over a wide supply voltage range from 2.0 to 4.8V allowing the SE2436L to be used in battery powered applications over a wide spectrum of the battery discharge curve.
The SE2436L can be designed into reference designs with SiLabs's EM357 device.
About the EM35x System-on-Chip (SoC) / Network Co-Processor (NCP)
The EM351 and EM357 Ember® ZigBee chips are the industry’s leading ARM Cortex-M3 based family of ZigBee SoCs delivering unmatched performance, power consumption and code density in a compact package. The EM351 and EM357 combine a 2.4 GHz IEEE 802.15.4 radio transceiver with a 32-bit microprocessor, Flash memory and RAM with powerful hardware supported network-level debugging features. Combined with the powerful ecosystem of ARM tools, these devices and tools enable OEMs to simplify development and accelerate time to market.
The EM351 and EM357 SoCs are tightly integrated with EmberZNet PRO, a ZigBee compliant mesh networking software which is the most deployed ZigBee platform in the market.
EM35x chips can be designed in as full system-on-chip (SoC) devices for low cost, low power sensors and other devices in the home, or as network co-processor (NCP) devices for more complex applications running on a large applications microprocessor.250 and EM260 chips are tightly integrated with EmberZNet PRO - The Ember "ZigBee Golden Unit" platform - and are optimized for designs requiring long battery life, low external component count, and a reliable, proven, industry-standard networking solution. Innovative on-chip debugging combined with Ember InSight tools provide developers with the most advanced views into their application and network available in the industry.
For more information regarding the EM35x please visit: www.silabs.com.
The SE2435L is a high performance, highly integrated RF Front End Module designed for high power ISM band applications operating in the 860 – 930 MHz frequency band.
The SE2435L is designed for ease of use and maximum flexibility, with fully matched 50 Ω input and output, and digital controls compatible with 1.6 – 3.6 V CMOS levels.
The RF blocks operate over a wide supply voltage range from 2.0 to 4.8 V allowing the SE2435L to be used in battery powered applications over a wide spectrum of the battery discharge curve.
The SE2435L has been designed into reference designs with STMicroelectronics' SPIRIT1 device.
About the STM Sub GHz transceiver daughterboard with power amplifier based on the SPIRIT1 (868 MHz band)
The STEVAL-IKR001V8D demonstration board isbased on the SPIRIT1, a sub GHz low power, lowdata rate transceiver suitable for ISM bands andwireless M-BUS systems.
The STEVAL-IKR001V8D includes an RF Front End Module from Skyworks®, which allowsthe application to reach +27 dBm (500 mW)output power.
The reference design collateral can be downloaded from http://www.st.com/web/catalog/tools/FM116/SC1075/PF258319.
For more information regarding the STM SPIRIT1 please visit: www.st.com.
About the EM35x System-on-Chip (SoC) / Network Co-Processor (NCP)
The EM351 and EM357 Ember® ZigBee chips are the industry’s leading ARM Cortex-M3 based family of ZigBee SoCs delivering unmatched performance, power consumption and code density in a compact package. The EM351 and EM357 combine a 2.4 GHz IEEE 802.15.4 radio transceiver with a 32-bit microprocessor, Flash memory and RAM with powerful hardware supported network-level debugging features. Combined with the powerful ecosystem of ARM tools, these devices and tools enable OEMs to simplify development and accelerate time to market.
The EM351 and EM357 SoCs are tightly integrated with EmberZNet PRO, a ZigBee compliant mesh networking software which is the most deployed ZigBee platform in the market.
EM35x chips can be designed in as full system-on-chip (SoC) devices for low cost, low power sensors and other devices in the home, or as network co-processor (NCP) devices for more complex applications running on a large applications microprocessor.250 and EM260 chips are tightly integrated with EmberZNet PRO - The Ember "ZigBee Golden Unit" platform - and are optimized for designs requiring long battery life, low external component count, and a reliable, proven, industry-standard networking solution. Innovative on-chip debugging combined with Ember InSight tools provide developers with the most advanced views into their application and network available in the industry.
For more information regarding the EM35x please visit: www.silabs.com.
Reference Design:
The CC2530-SE2431L Reference Design contains schematic and layout for the CC2530-SE2431 evaluation module. The reference design demonstrates how to integrate CC2530/CC2531 and SE2431L, and the application note shows the RF performance of the combo and suggests ways for RF layout. For optimum RF performance, the schematic and layout should be copied as closely as possible. This is a 4-layer reference design with both an SMA connector for RF output matched to 50 ohm and an inverted-F PCB antenna.
For more information regarding the CC2530-SE2431L reference design please visit: www.ti.com.
The SKY96503-11 is a single-pole, thirteen-throw (SP13T) antenna switch module with integrated filters and a Mobile Industry Processor Interface (MIPI), Version 2.0. Receive filters for bands 8, 26, 3, 39, 1, 34, 41N, and 40 are integrated into the module.
Using advanced switching technologies, the SKY96503-11 maintains low insertion loss and high isolation for receive switching paths. The high-linearity performance and low insertion loss achieved by the SKY96503-11 makes it an ideal choice for UMTS, CDMA2000, and LTE applications.
Switching is controlled by an integrated MIPI interface. Depending on the logic applied to the decoder, the antenna pin is connected to up to 2 of 13 switched RF ports using a low insertion loss path, while the paths between the antenna pin and the other RF pins are in a high isolation state. No external DC blocking capacitors are required on the RF paths.
The SKY96503-11 is manufactured in a compact, 3.5 x 3.0 x 0.65 mm, 24-pin surface-mount Quad Flat No-Lead (QFN) package.
]]>SKY77916-21, a Tx / Rx Front-End Module (FEM), offers the complete transmit VCO-to-Antenna and Antenna-to-receive SAW filter solution for advanced cellular handsets comprising quad-band GSM, GPRS, EDGE multi-slot operation, and TD-SCDMA and TDD LTE transmission. The FEM fully enables broadband 3G/4G RF switch-through, outward switching of the Power Amplifier (PA) RF inputs, 14 transmit / receive (TRx) antenna switch ports, and an integrated directional coupler.
A new multi-standard CMOS controller provides PA band/mode selection and bias control, including the Mobile Industry Processor Interface (MIPI®) RFFE logic, and switch decoder circuitry. The controller supports user-optional control of linear RF or analog VRAMP of the GMSK envelope. A distinct MIPI register mapping included in the Data Sheet provides for each of these control paradigms, including associated approaches to PA and switch control.
The Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated in Gallium Arsenide (GaAs). The low band (LB) PA transmits in the GSM850/900 bands. The high band (HB) PA supports DCS, PCS, TD-SCDMA bands 34/39, and TDD LTE band 39. The HBT, switch, and controller die, and passive components mount onto a multi-layer laminate substrate and the entire assembly encapsulated with plastic over-mold.
Built into the SKY77916-21 is a complete features set for state-of-the-art performance and minimal phone board complexity, including PA over-voltage and over-current protection, 50 ohms matching and zero DC offset on all RF pins, TRx high linearity/low loss switching and high off-state isolation, integrated directional coupler, IEC ruggedness at antenna output, LB and HB input switching for alternate routing of 3G/4G Tx paths, power supply pads shared between LB and HB, and ultra-low leakage currents for long standby times.
Selecting the linear-GMSK operation standard disables VRAMP input so all PA biasing depends only on MIPI mode selection. The transmitted envelope is a linear function of RF input.
Selecting VRAMP-enabled operation, the PA controller provides VRAMP control of the GMSK envelope and reduces sensitivity to input drive, temperature, power supply, and process variations. Skyworks’ Finger-Based Integrated Power Amplifier Control (FB-iPAC) minimizes output power variation into mismatch. In EDGE and TD-SCDMA / TDD LTE linear modes, VRAMP voltage and MIPI-based bias settings jointly optimize PA linearity and efficiency.
The SKY66397-12 is a high-efficiency fully input/output matchedpower amplifier (PA) with high gain and linearity. The compact5 X 5 mm PA is designed for FDD and TDD 2G/3G/4G LTE smallcell base stations operating from 2300 to 2700 MHz. The activebiasing circuitry is integrated to compensate PA performance overtemperature, voltage, and process variation.
The SKY66397-12 is part of high-efficiency, pin-to-pin compatiblePA family supporting all 3GPP bands. Table 1 lists the pin-to-pincompatible parts in the PA family.
]]>Reference Design(s):
Reference Design(s):
The SKY65336-11 is a high efficiency, 8 x 8 millimeter multi-chip front-end module (FEM) for ZigBee and other 2.4 GHz industrial, scientific and medical (ISM) band applications. The FEM is comprised of a selectable transmit and receive (Tx/Rx) path. The Tx path incorporates a harmonic filter and high efficiency PA which delivers 20 dBm at the module's output port. The Rx path includes a low noise amplifier (LNA) which boasts a total Rx path noise figure of 1.9 dB, including switch loss. Both the Tx and Rx paths integrate baluns to provide differential ports and seamlessly interface with Silicon Labs’ Ember EM250 and EM260 ZigBee™ transceivers.
About the EM250 & EM260
The Ember EM250 system-on-chip (SoC) along with the EmberZNet PRO networking stack is the industry's only true SoC platform supporting the ZigBee PRO Feature Set. The EM250 integrates an IEEE 802.15.4 radio, a 16-bit microprocessor, flash, random access memory (RAM) and peripherals delivering excellent performance at a low system cost.
The Ember EM260 is the industry's first ZigBee network co-processor that combines a 2.4 gigahertz (GHz) IEEE 802.15.4 compliant radio transceiver with a flash-based microprocessor running the EmberZNet PRO ZigBee stack. The EM260 delivers unparalleled flexibility allowing developers to easily add ZigBee networking to their preferred application microprocessor via a fast SPI/UART interface.
The EM250 and EM260 chips are tightly integrated with EmberZNet PRO - The Ember "ZigBee Golden Unit" platform - and are optimized for designs requiring long battery life, low external component count, and a reliable, proven, industry-standard networking solution. Innovative on-chip debugging combined with Ember InSight tools provide developers with the most advanced views into their application and network available in the industry.
For more information regarding the EM250 and EM260 please visit: www.silabs.com.
Reference Design(s):