Please note: SMV1251-011LF is being discontinued and is not recommended for new designs.
]]>The SKY67302-11 consists of a low-noise amplifier, digital stepattenuator and I2C circuit to digitally control the module. Thismodule architecture provides excellent return loss, low noise, andhigh-linearity performance.
The internal active bias circuitry ensures repeatable performanceover temperature. The device is fully integrated and requiresminimal external components.
The SKY67302-11 is manufactured in an 8 x 8 mm,16-pin Multi-Chip Module (MCM) package. The SKY67302-11 ispart of a family of LNAs that cover the frequency range of648 MHz to 2020 MHz.
Reference Design(s):
Reference Design(s):
About the EM250 & EM260
The Ember EM250 system-on-chip (SoC) along with the EmberZNet PRO networking stack is the industry's only true SoC platform supporting the ZigBee PRO Feature Set. The EM250 integrates an IEEE 802.15.4 radio, a 16-bit microprocessor, flash, random access memory (RAM) and peripherals delivering excellent performance at a low system cost.
The Ember EM260 is the industry's first ZigBee network co-processor that combines a 2.4 gigahertz (GHz) IEEE 802.15.4 compliant radio transceiver with a flash-based microprocessor running the EmberZNet PRO ZigBee stack. The EM260 delivers unparalleled flexibility allowing developers to easily add ZigBee networking to their preferred application microprocessor via a fast SPI/UART interface.
The EM250 and EM260 chips are tightly integrated with EmberZNet PRO - The Ember "ZigBee Golden Unit" platform - and are optimized for designs requiring long battery life, low external component count, and a reliable, proven, industry-standard networking solution. Innovative on-chip debugging combined with Ember InSight tools provide developers with the most advanced views into their application and network available in the industry.
For more information regarding the EM250 and EM260 please visit: www.silabs.com.
About the EM250 & EM260
The Ember EM250 system-on-chip (SoC) along with the EmberZNet PRO networking stack is the industry's only true SoC platform supporting the ZigBee PRO Feature Set. The EM250 integrates an IEEE 802.15.4 radio, a 16-bit microprocessor, flash, random access memory (RAM) and peripherals delivering excellent performance at a low system cost.
The Ember EM260 is the industry's first ZigBee network co-processor that combines a 2.4 gigahertz (GHz) IEEE 802.15.4 compliant radio transceiver with a flash-based microprocessor running the EmberZNet PRO ZigBee stack. The EM260 delivers unparalleled flexibility allowing developers to easily add ZigBee networking to their preferred application microprocessor via a fast SPI/UART interface.
The EM250 and EM260 chips are tightly integrated with EmberZNet PRO - The Ember "ZigBee Golden Unit" platform - and are optimized for designs requiring long battery life, low external component count, and a reliable, proven, industry-standard networking solution. Innovative on-chip debugging combined with Ember InSight tools provide developers with the most advanced views into their application and network available in the industry.
For more information regarding the EM250 and EM260 please visit: www.silabs.com.
Reference Design(s):
The part is designed to sustain a peak voltage of 80 V typicalwithout going to breakdown.
The switching is controlled by an integrated Mobile IndustryProcessor Interface (MIPI®), v2.0 decoder.
The SKY59269-702LF is provided in a compact 12-pin,1.6 x 1.6 x 0.45 mm (typical) QFN package that meetsrequirements for board-level assembly.
]]>The diversity module supports all key 2, 3, and 4 carrier aggregation band combinations.
High-performance, multi-gain mode LNAs are integrated enabling compatibility to next generation LNA-less LTE transceivers.
The SKY53735-11 is compatible with 3GPP GSM, WCDMA, LTE, LTE-A, and 5G standards and includes filters for the following service bands: B12/13/17, B28A, B28B, B20, B8, B26/5/18/19, B32, B3, B39, B25(2), B34, B66(4), B1, B40, B41(38), and B7.
]]>About the EM35x System-on-Chip (SoC) / Network Co-Processor (NCP)
The EM351 and EM357 Ember® ZigBee chips are the industry’s leading ARM Cortex-M3 based family of ZigBee SoCs delivering unmatched performance, power consumption and code density in a compact package. The EM351 and EM357 combine a 2.4 GHz IEEE 802.15.4 radio transceiver with a 32-bit microprocessor, Flash memory and RAM with powerful hardware supported network-level debugging features. Combined with the powerful ecosystem of ARM tools, these devices and tools enable OEMs to simplify development and accelerate time to market.
The EM351 and EM357 SoCs are tightly integrated with EmberZNet PRO, a ZigBee compliant mesh networking software which is the most deployed ZigBee platform in the market.
EM35x chips can be designed in as full system-on-chip (SoC) devices for low cost, low power sensors and other devices in the home, or as network co-processor (NCP) devices for more complex applications running on a large applications microprocessor.250 and EM260 chips are tightly integrated with EmberZNet PRO - The Ember "ZigBee Golden Unit" platform - and are optimized for designs requiring long battery life, low external component count, and a reliable, proven, industry-standard networking solution. Innovative on-chip debugging combined with Ember InSight tools provide developers with the most advanced views into their application and network available in the industry.
For more information regarding the EM35x please visit: www.silabs.com.
About the EM35x System-on-Chip (SoC) / Network Co-Processor (NCP)
The EM351 and EM357 Ember® ZigBee chips are the industry’s leading ARM Cortex-M3 based family of ZigBee SoCs delivering unmatched performance, power consumption and code density in a compact package. The EM351 and EM357 combine a 2.4 GHz IEEE 802.15.4 radio transceiver with a 32-bit microprocessor, Flash memory and RAM with powerful hardware supported network-level debugging features. Combined with the powerful ecosystem of ARM tools, these devices and tools enable OEMs to simplify development and accelerate time to market.
The EM351 and EM357 SoCs are tightly integrated with EmberZNet PRO, a ZigBee compliant mesh networking software which is the most deployed ZigBee platform in the market.
EM35x chips can be designed in as full system-on-chip (SoC) devices for low cost, low power sensors and other devices in the home, or as network co-processor (NCP) devices for more complex applications running on a large applications microprocessor.250 and EM260 chips are tightly integrated with EmberZNet PRO - The Ember "ZigBee Golden Unit" platform - and are optimized for designs requiring long battery life, low external component count, and a reliable, proven, industry-standard networking solution. Innovative on-chip debugging combined with Ember InSight tools provide developers with the most advanced views into their application and network available in the industry.
For more information regarding the EM35x please visit: www.silabs.com.
About the STM Sub GHz transceiver daughterboard with power amplifier based on the SPIRIT1 (868 MHz band)
The STEVAL-IKR001V8D demonstration board isbased on the SPIRIT1, a sub GHz low power, lowdata rate transceiver suitable for ISM bands andwireless M-BUS systems.
The STEVAL-IKR001V8D includes an RF Front End Module from Skyworks®, which allowsthe application to reach +27 dBm (500 mW)output power.
The reference design collateral can be downloaded from http://www.st.com/web/catalog/tools/FM116/SC1075/PF258319.
For more information regarding the STM SPIRIT1 please visit: www.st.com.
About the EM35x System-on-Chip (SoC) / Network Co-Processor (NCP)
The EM351 and EM357 Ember® ZigBee chips are the industry’s leading ARM Cortex-M3 based family of ZigBee SoCs delivering unmatched performance, power consumption and code density in a compact package. The EM351 and EM357 combine a 2.4 GHz IEEE 802.15.4 radio transceiver with a 32-bit microprocessor, Flash memory and RAM with powerful hardware supported network-level debugging features. Combined with the powerful ecosystem of ARM tools, these devices and tools enable OEMs to simplify development and accelerate time to market.
The EM351 and EM357 SoCs are tightly integrated with EmberZNet PRO, a ZigBee compliant mesh networking software which is the most deployed ZigBee platform in the market.
EM35x chips can be designed in as full system-on-chip (SoC) devices for low cost, low power sensors and other devices in the home, or as network co-processor (NCP) devices for more complex applications running on a large applications microprocessor.250 and EM260 chips are tightly integrated with EmberZNet PRO - The Ember "ZigBee Golden Unit" platform - and are optimized for designs requiring long battery life, low external component count, and a reliable, proven, industry-standard networking solution. Innovative on-chip debugging combined with Ember InSight tools provide developers with the most advanced views into their application and network available in the industry.
For more information regarding the EM35x please visit: www.silabs.com.
Reference Design:
The CC2530-SE2431L Reference Design contains schematic and layout for the CC2530-SE2431 evaluation module. The reference design demonstrates how to integrate CC2530/CC2531 and SE2431L, and the application note shows the RF performance of the combo and suggests ways for RF layout. For optimum RF performance, the schematic and layout should be copied as closely as possible. This is a 4-layer reference design with both an SMA connector for RF output matched to 50 ohm and an inverted-F PCB antenna.
For more information regarding the CC2530-SE2431L reference design please visit: www.ti.com.
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]]>The SKY66397-12 is a high-efficiency fully input/output matchedpower amplifier (PA) with high gain and linearity. The compact5 X 5 mm PA is designed for FDD and TDD 2G/3G/4G LTE smallcell base stations operating from 2300 to 2700 MHz. The activebiasing circuitry is integrated to compensate PA performance overtemperature, voltage, and process variation.
The SKY66397-12 is part of high-efficiency, pin-to-pin compatiblePA family supporting all 3GPP bands. Table 1 lists the pin-to-pincompatible parts in the PA family.