Multi-Mode / Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets

Skyworks SKY77604-11 is a hybrid multi-mode, multi-band Power Amplifier Module (PAM) that supports 2.5G and 3G handsets, and operates efficiently in GSM, EGPRS, EDGE WCDMA modes.

The PAM consists of a GSM800/EGSM900 PA block, a DCS1800/PCS1900 PA block, separate WCDMA blocks for low and high bands, RF input / output ports internally matched to 50 Ω to reduce the number of external components, and a Multi- Function Control (MFC) block. A custom BiCMOS integrated circuit provides the internal MFC interface and operation. Extremely low leakage current maximizes handset standby time.

2.5G: The SKY77604-11 supports the GSM850, EGSM900, DCS1800, and PCS1900 bands. The PAM also supports 2.5G Class 12 Enhanced General Packet Radio Service (EGPRS) multi-slot operation and EDGE linear modulation.

3G: The SKY77604-11 uses Load Insensitive Power Amplifier (LIPA®) circuitry to support WCDMA, High-Speed Downlink Packet Access (HSDPA), and High-Speed Uplink Packet Access (HSUPA) modulation at a high antenna Voltage Standing-Wave Ratio (VSWR). This functionality covers multiple bands for 3GPP including bands I, II, IV, IX, X, V, VIII.

The module is fully programmable through a Serial Peripheral Interface (SPI).

The InGaP die, the silicon die, and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.

The SKY77604-11 is encapsulated in a 6 mm x 8 mm, 34-pad MCM, Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable, low-cost solution.



Product Summary

SKY77604-11 Multimode Multiband Power Amplifier Module for Next Generation GGE and HSPA Handsets

201243c.pdf (610 KB)




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