Multi-Mode / Multi-Band Power Amplifier Module for Next Generation GGE and HSPA Handsets
Skyworks SKY77604-11 is a hybrid multi-mode, multi-band Power
Amplifier Module (PAM) that supports 2.5G and 3G handsets, and
operates efficiently in GSM, EGPRS, EDGE WCDMA modes.
The PAM consists of a GSM800/EGSM900 PA block, a
DCS1800/PCS1900 PA block, separate WCDMA blocks for low
and high bands, RF input / output ports internally matched to
50 Ω to reduce the number of external components, and a Multi-
Function Control (MFC) block. A custom BiCMOS integrated circuit
provides the internal MFC interface and operation. Extremely low
leakage current maximizes handset standby time.
2.5G: The SKY77604-11 supports the GSM850, EGSM900, DCS1800,
and PCS1900 bands. The PAM also supports 2.5G Class 12
Enhanced General Packet Radio Service (EGPRS) multi-slot
operation and EDGE linear modulation.
3G: The SKY77604-11 uses Load Insensitive Power Amplifier (LIPA®)
circuitry to support WCDMA, High-Speed Downlink Packet Access
(HSDPA), and High-Speed Uplink Packet Access (HSUPA)
modulation at a high antenna Voltage Standing-Wave Ratio
(VSWR). This functionality covers multiple bands for 3GPP
including bands I, II, IV, IX, X, V, VIII.
The module is fully programmable through a Serial Peripheral
The InGaP die, the silicon die, and passive components are
mounted on a multi-layer laminate substrate. The assembly is
encapsulated with plastic overmold.
The SKY77604-11 is encapsulated in a 6 mm x 8 mm, 34-pad MCM,
Surface-Mounted Technology (SMT) package, which allows for a
highly manufacturable, low-cost solution.
SKY77604-11 Multimode Multiband Power Amplifier Module for Next Generation GGE and HSPA Handsets
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