SKY58501-16

Sky5® Front-End Module for NR, LTE, WCDMA, Quad-Band, 2G, and Diversity Applications

The SKY58501-16 front-end module (FEM) is a fully matched, 154-pad surface mount (SMT) module developed for 5G/4G/3G/2G/LTE/WCDMA/ HSDPA/ HSUPA applications.

The FEM consists of a 3/4/5G PA block, quad-band, 2G PA block, input and output matching, a MIPI standard digital control block, single-ended primary duplexers, diversity RX filters, antenna and band select switches, and primary and diversity LNAs.

The SKY58501-16 is part of our Sky5® product portfolio.

The SKY58501-16 uses an enhanced architecture to cover multiple bands and meet the spectral linearity requirements of LTE QPSK, 16QAM, 64QAM, 256QAM modulations with up to 35 MHz bandwidth.

Output power is controlled by varying the input power and VCC is adjusted using a buck/boost power management integrated circuit (PMIC) to maximize efficiency. Extremely low leakage current maximizes handset standby time.

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Specifications

Function5G-LB

Description5G LB TRM 1T2R

SKUGLOBAL

Package (mm)8.25 x 5.6

Package154-pad DSMGA

Features

Quad-band 2G GSM/GPRS/EDGE
LNA and Power Amplifier Module with integrated Filters (L-PAMiD) covering B8, B12, B13, B14, B20, B26, B28A/28B, B29, B71 with integrated quadband 2G and DRX functionality
LTE bands 5, 8, 12 to 14, 17 to 20, 26, 28A, 28B, 29, and 71
Supports CA_20_28A
Integrated PAs and filters to support DC_20_n28A
TX MIPI® v2.1 compliant 52 MHz RFFE bus
RX MIPI v3.0 compliant 52 MHz RFFE bus
Enhanced high-efficiency APT PA core
Integrated antenna and band select switches
B29 RX path switched through B28B TX filter
Two antenna ports with antenna swapping feature
Integrated bi-directional RF coupler with attenuator
Supports linear and VRAMP 2G
Integrated primary and diversity low noise amplifier (LNA) with MIPI control features:
- Baseband agnostic design for 10 gain modes
- Independent gain and bias control
Continuous bias control via RFFE interface
Low supply voltage
Low leakage current in power-down mode
SkyShield™ shielded module
Small, low-profile package:
- 5.6 mm x 8.25 mm x 0.75 mm (max.)
- 154-pad DSMGA package
Lead (Pb)-free MSL3 @ 260 °C per JEDEC J-STD-020

Applications

5G New Radio

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Smartphones

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