The SKY13434-002 is a GaAs pHEMT wire-bondable die. The device includes a Single-Pole, Triple-Throw (SP3T) antenna switch for 2.5 GHz transmit, receive, and Bluetooth operations, and a Single-Pole, Double-Throw (SPDT) antenna switch for 5 GHz transmit and receive operation.

Any of the RF ports can be used for any RF function regardless of the pad/signal name. Both of the antenna switches are fabricated on the same substrate.

The active path is selected using five positive voltage control lines: two control lines set the 5 GHz switch states and three control lines set the 2.5 GHz switch states. The switch requires external DC blocking capacitors on all RF paths.

The SKY13434-002 is provided as a bare die in an ultra-compact 875 x 500 x 127 μm design. Bond pad openings are 60 microns with a minimum pad pitch of 80 microns.

Please note: SKY13434-002 is being discontinued and is not recommended for new designs.