SKY13550-667LF

0.4 to 3.8 GHz DP8T (SP4T/SP4T) Main/Receive Diversity Switch with MIPI RFFE Interface for Carrier Aggregation

Please note: SKY13550-667LF is being discontinued and is not recommended for new designs. The suggested replacement is SKY13551-668LF

The SKY13550-667LF is a dual single-pole, four-throw (2xSP4T) Mobile Industry Processor Interface (MIPI) controlled antenna switch designed specifically for receive diversity in carrier aggregation applications.

The 2xSP4T switch is optimized for broadband performance. Using advanced switching technologies, the SKY13550-667LF maintains low insertion loss and high isolation for all switching paths. The high linearity performance and low insertion loss achieved by the SKY13550-667LF makes it an ideal choice for carrier aggregation applications. The switch also exhibits excellent second/third order intermodulation distortion (IMD2/IMD3) performance.

Switching is controlled by an integrated MIPI decoder. The two switches can be configured independently. There are separate registers for each SP4T. No external DC blocking capacitors are required on the RF paths as long as no DC voltage is applied to those paths.

The SKY13550-667LF is manufactured in a compact, 1.6 x 2.0 x 0.55 mm, 14-pin surface-mount Quad Flat No-Lead (QFN) package.

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Specifications

Product LifecycleLast Time Buy

DescriptionDP8T (SP4T/SP4T), carrier aggregation switch

Replacement Part SKY13551-668LF

Main or Diversity functionMain/Diversity

Number of Low Band Ports4

Number of High Band Ports4

Package X Dimension (mm)1.6

Package Y Dimension (mm)2.0

Control LogicMIPI

Thickness (mm)0.55

Package TypeQFN

Number of Pins/Bumps14

Features

Broadband frequency range: 0.4 to 3.8 GHz
Single, positive DC power supply (2.5 to 4.8 V)
Excellent Band 13 2nd harmonic performance
Excellent Band 17 3rd harmonic performance
Integrated, programmable MIPI interface using separate registers for ANT_A and ANT_B bands
Dual antenna ports can be connected externally to a diplexer
Small QFN (14-pin, 1.6 x 2.0 x 0.55 mm) package (MSL1, 260 °C per JEDEC J-STD-020)

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