Si3050 extends the market-leading performance of our Silicon Direct Access Arrangement (DAA) products into the voice telephony market. The small footprint chipset consists of a 20-pin Si3050 (TSSOP) system-side device and either the 16-pin Si3019 (TSSOP) or the 16-pin Si3018 (SOIC) line-side device. Si3050 features our patented capacitive isolation technology with low-cost, high voltage capacitors instead of a costly and bulky transformer and contains both a PCM highway/SPI interface for most standard telephony applications, as well as a GCI interface for customers with legacy requirements.