Please note: this product is being discontinued and is not recommended for new designs.
The AWB7231 is a fully matched, Multi-Chip-Module
(MCM) designed for picocell, femtocell, and customer
premises equipment (CPE) applications. Its high
linearity and efficiency meet the extremely demanding
needs of small cell infrastructure architectures.
Designed for LTE,WCDMA and HSDPA air interfaces
operating in the 2.01 to 2.025 GHz band, the
AWB7231 delivers up to +27 dBm of LTE (E-TM1.1)
power with an ACPR of -47 dBc. It operates from
a convenient +4.5 V supply and provides 29 dB of
gain. The device is manufactured using an advanced
InGaP HBT MMIC technology offering state-of-the-art
reliability, temperature stability, and ruggedness.
The self-contained 7 mm x 7 mm x 1.3 mm surface
mount package incorporates RF matching networks
optimized for output power, efficiency, and linearity in
a 50 Ω system.