Please note: SKY19003-001 is being discontinued and is not recommended for new designs.
The suggested replacement
The SKY19003-001 is a wafer level chip scale package (WLCSP)
dual-shunt, single-pole, single-throw (2xSPST) switch with
integrated logic and bias block. Both paths are connected on one
side to a single RF ground bump.
The SKY19003-001 linearity is high enough to meet carrier
aggregation requirements. The part is designed to sustain a peak
voltage of 80 V typical without going to breakdown.
The logic block operates with a 1.8 V high control voltage and
requires a 2.85 V nominal VDD supply.
The SKY19003-001 is provided in a compact 8-bump,
1.277 x 1.377 x 0.4 mm WLCSP that meets requirements for
board-level assembly. Bump diameters are 217 microns, with a
minimum bump pitch of 400 microns.