Please note: SKY19237-001 is being discontinued and is not recommended for new designs.
The suggested replacement
is
SKY59272-707LF
The SKY19237-001 is a wafer level chip scale package (WLCSP)
triple-shunt, single-pole, single-throw (3xSPST) switch with
integrated logic and bias block. The three paths are connected on
one side to a single RF ground bump.
The part is designed to sustain a peak voltage of 83 V typical
without going to breakdown.
The switching is controlled by an integrated Mobile Industry
Processor Interface (MIPI) decoder.
The SKY19237-001 is provided in a compact 11-bump,
1.66 × 1.75 × 0.5 mm (typical) WLCSP that meets requirements
for board-level assembly. Bump diameters are 262 µm, with a
minimum bump pitch of 400 µm.